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P40-G Series TBU ? High-Speed Protectors
Product Dimensions
B
C
F
G
K
E
K
F
N
Dim.
A
Min.
3.90
(.154)
Typ.
4.00
(.157)
Max.
4.10
(.161)
4
5
6
H
B
3.90
(.154)
4.00
(.157)
4.10
(.161)
A
C
0.80
(.031)
0.85
(.033)
0.90
(.035)
PIN 1
D
G
3
J
2
J
1
H
M
N
D
E
F
0.000
(.000)
2.55
(.100)
0.20
(.008)
0.025
(.001)
2.60
(.102)
0.25
(.010)
0.050
(.002)
2.65
(.104)
0.30
(.012)
TOP VIEW
Recommended Pad Layout
SIDE VIEW
BOTTOM VIEW
G
H
0.75
(.030)
1.40
(.055)
0.80
(.031)
1.45
(.057)
0.85
(.033)
1.50
(.059)
0.35
(.014)
0.90
(.035)
0.30 +0.05/-0.00
(.012 +.002/-.000)
2.60
(.102)
1.45
(.057)
Pad Designation
Pad # Apply
1 In1
2 NC
3
Out1
J
K
M
N
0.10
(.004)
0.25
(.010)
0.55
(.022)
0.20
(.008)
0.15
(.006)
0.30
(.012)
0.60
(.024)
0.25
(.010)
0.20
(.008)
0.35
(.014)
0.65
(.026)
0.30
(.012)
4
Out2
0.30
5
6
NC
In2
DIMENSIONS:
MM
(INCHES)
(.012)
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
Block Diagram
TBU ? devices have matte-tin termination ?nish. Suggested layout should use non-solder
mask de?ne (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with
stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat
sinking any power device, it is recommended that, wherever possible, extra PCB copper area
6
1
4
3
is allowed. For minimum parasitic capacitance, do not allow any signal, ground or power
signals beneath any of the pads of the device.
TBU ? Device
Thermal Resistances
Thermal resistance using minimal pad size, where the power is the total power dissipated in the package. Additional copper pad area to be
used for additional heatsinking is also recommended.
Symbol
R th(j-a)
R th(j-a)
Parameter
Junction to Package Pads (1 TBU of Pair)
Junction to Package Pads (2 TBUs of Equal Power)
Value
250
180
Unit
°C/W
°C/W
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications.
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